| General information |
| Type |
CPU / Microprocessor |
| Market segment |
Mobile |
| Family |
AMD Mobile Sempron |
| Model number ? |
3200+ |
| CPU part number |
SMS3200HAX3CM is an OEM/tray microprocessor |
| Stepping codes |
ABBVF LEBAF LFBAF NEBAF NFBCF |
| Frequency (MHz) ? |
3400+ (rated)
1600 (real) |
| Clock multiplier ? |
8 |
| Package |
638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| AMD Package number |
29249 |
| Socket |
Socket S1 (S1g1) |
| Weight |
0.2oz / 6.8g |
| |
| Architecture / Microarchitecture |
| Microarchitecture |
K8 |
| Processor core ? |
Keene |
| Core stepping ? |
F2 |
| Manufacturing process |
0.09 micron |
| Data width |
64 bit |
| Number of cores |
1 |
| Floating Point Unit |
Integrated |
| Level 1 cache size ? |
64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? |
256 KB |
| Multiprocessing |
Uniprocessor |
| Features |
- MMX Technology
- 3DNow!
- SSE
- SSE2
- SSE3
- AMD64 technology ?
- Enhanced Virus Protection ?
|
| Low power features |
PowerNow! technology |
| On-chip peripherals |
- Dual-channel DDR2 SDRAM memory controller
- One 16-bit HyperTransport link with speeds up to 800 MHz
|
| |
| Electrical/Thermal parameters |
| V core (V) ? |
1.125 / 1.15 / 1.2 |
| Maximum operating temperature (°C) ? |
95 |
| Thermal Design Power (W) ? |
25 |
