| General information |
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| Type |
CPU / Microprocessor |
| Market segment |
Desktop |
| Family |
Intel Pentium Dual-Core |
| Model number ? |
G6950 |
| CPU part numbers |
CM806[zasłonięte]04593AE is an OEM/tray microprocessor
BX80616G6950 is a boxed processor (English version)
BXC80616G6950 is a boxed processor (Chinese version) |
| Frequency ? |
2x2800 MHz |
| Bus speed ? |
2.5 GT/s DMI |
| Clock multiplier ? |
21 |
| Package |
1156-land Flip-Chip Land Grid Array (FC-LGA10) |
| Socket |
Socket 1156 / H1 / LGA1156 |
| Size |
1.48" x 1.48" / 3.75cm x 3.75cm |
| Weight |
0.9oz / 24.6g (CPU)
12.1oz / 342.4g (box) |
| Fan/heatsink |
E41[zasłonięte]-002 |
| Introduction date |
January 7, 2010 |
| End-of-Life date |
Last order date for consumer processors is June 29, 2012
Last shipment date for consumer tray processors is December 7, 2012 |
| Price at introduction |
$87 |
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| S-spec numbers |
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ES/QS processors |
Production processors |
| Part number |
Q3GT |
Q4DH |
SLBMS |
SLBTG |
| BX80616G6950 |
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| BXC80616G6950 |
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| CM806[zasłonięte]04593AE |
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| Architecture / Microarchitecture |
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| Microarchitecture |
Nehalem (Westmere) |
| Processor core ? |
Clarkdale |
| Core steppings ? |
C2 (Q3GT, SLBMS)
K0 (SLBTG) |
| CPUID |
20652 (SLBMS) |
| Manufacturing process |
0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die) |
| Die size |
81mm2 (CPU die)
114mm2 (IMC / graphics die) |
| Data width |
64 bit |
| The number of cores |
2 |
| The number of threads |
2 |
| Floating Point Unit |
Integrated |
| Level 1 cache size ? |
2 x 32 KB instruction caches
2 x 32 KB data caches |
| Level 2 cache size ? |
2 x 256 KB |
| Level 3 cache size |
3 MB shared cache |
| Physical memory |
16 GB |
| Multiprocessing |
Not supported |
| Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- EM64T / Extended Memory 64 technology / Intel 64 ?
- VT-x / Virtualization technology ?
- NX / XD / Execute disable bit ?
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| Low power features |
- Thread C1, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology ?
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| Integrated peripherals / components |
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| Integrated graphics |
- GPU Type: HD (Nehalem)
Base frequency (MHz): 533
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| Memory controller |
- The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066
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| Other peripherals |
- Direct Media Interface
- PCI Express 2.0 interface
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| Electrical / Thermal parameters |
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| V core ? |
0.65V - 1.4V |
| Minimum/Maximum operating temperature ? |
5°C - 72.6°C |
| Maximum power dissipation ? |
6 Watt (TDP in C6 state) / 170.83 Watt (peak)
128.71 Watt (sustained) |
| Thermal Design Power ? |
73 Watt |
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| Notes on Intel CM806[zasłonięte]04593AE |
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- Also available as an embedded microprocessor
- Graphics and memory controllers are located on a separate die, which is manufactured on 0.045 micron technology
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