Architecture / Microarchitecture |
Microarchitecture |
K10 |
Processor core ? |
Toliman |
Core stepping ? |
B3 |
Manufacturing process |
0.065 micron |
Die size |
285mm2 |
Data width |
64 bit |
The number of cores |
3 |
The number of threads |
3 |
Floating Point Unit |
Integrated |
Level 1 cache size ? |
3 x 64 KB 2-way associative instruction caches 3 x 64 KB 2-way associative data caches |
Level 2 cache size ? |
3 x 512 KB 16-way set associative caches |
Level 3 cache size |
2 MB 32-way set associative shared cache |
Multiprocessing |
Uniprocessor |
Features |
- MMX instructions
- 3DNow! technology
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSE4a ?
- ABM / Advanced Bit Manipulation ?
- AMD64 / AMD 64-bit technology ?
- AMD-V / AMD Virtualization technology
- EVP / Enhanced Virus Protection ?
|
Low power features |
- Cool'n'Quiet 2.0
- CoolCore technology ?
- Independent Dynamic Core Technology ?
- Dual Dynamic Power Management ?
- Core C1 and C1E states
- Package S1, S3, S4 and S5 states
|
|
Integrated peripherals / components |
Memory controller |
- The number of controllers: 1
Memory channels: 2 Channel width (bits): 72 Supported memory: DDR2-1066 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 17.1
|
Other peripherals |
HyperTransport 3 technology |
|
Electrical / Thermal parameters |
V core ? |
1.2V - 1.25V |
V NorthBridge |
1.25V |
Maximum operating temperature ? |
55°C - 71°C |
Thermal Design Power ? |
95 Watt |