| General information |
| Type |
CPU / Microprocessor |
| Market segment |
Mobile |
| Family |
Intel Core i3 Mobile |
| Model number ? |
i3-350M |
| CPU part number |
CP806[zasłonięte]04161AC is an OEM/tray microprocessor |
| Frequency (MHz) ? |
2267 |
| Low power frequency (MHz) |
933 |
| Clock multiplier ? |
17 |
| Package |
988-pin micro-FCPGA10 (rPGA988A) |
| Socket |
Socket G1 (rPGA988A) |
| Size |
1.48" x 1.48" / 3.75cm x 3.75cm |
| Weight |
0.3oz / 7.7g |
| Introduction date |
January 7, 2010 |
| S-spec numbers |
| Production processors |
| Part number |
SLBPK |
SLBU5 |
| CP806[zasłonięte]04161AC |
+ |
+ |
|
| Architecture / Microarchitecture |
| Microarchitecture |
Nehalem (Westmere) |
| Platform |
Calpella |
| Processor core ? |
Arrandale |
| Core steppings ? |
C2 (SLBPK)
K0 (SLBU5) |
| CPUIDs |
20652 (SLBPK)
20655 (SLBU5) |
| Manufacturing process |
0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die) |
| Die size |
- 81 (CPU die)
- 114 (IMC / graphics die) mm2
|
| Data width |
64 bit |
| Number of cores |
2 |
| Floating Point Unit |
Integrated |
| Level 1 cache size ? |
2 x 32 KB instruction caches
2 x 32 KB data caches |
| Level 2 cache size ? |
2 x 256 KB |
| Level 3 cache size |
Shared 3 MB |
| Cache latency |
4 (L1 cache)
11 (L2 cache)
37 (L3 cache) |
| Multiprocessing |
Not supported |
| Features |
- MMX instruction set
- SSE
- SSE2
- SSE3
- Supplemental SSE3
- SSE4.1 ?
- SSE4.2 ?
- EM64T technology ?
- Hyper-Threading technology ?
- Virtualization technology ?
- Execute Disable bit ?
|
| Low power features |
- Thread C1, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology ?
|
| On-chip peripherals |
- Integrated dual-channel DDR3 SDRAM Memory controller
- Direct Media Interface
- Integrated HD graphics controller
|
| Electrical/Thermal parameters |
| V core (V) ? |
0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode) |
| Minimum/Maximum operating temperature (°C) ? |
0 - 90 |
| Maximum power dissipation (W) ? |
67.2 (peak, CPU core only)
44.8 (sustained, CPU core only) |
| Thermal Design Power (W) ? |
35 (Package)
25 (CPU core)
12.5 (Graphics core) |
| Notes on Intel CP806[zasłonięte]04161AC |
- Graphics and memory controllers are located on a separate die, which is manufactured on 0.045 micron technology
- Integrated graphics controller runs at 500 MHz, and up to 667 MHz in Turbo mode
- Memory controller supports DDR3-800 and DDR3-1066 memory
|
