| General information |
| |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | AMD Turion II Dual-Core Mobile |
| Model number ? | N530 |
| CPU part number | TMN530DCR23GM is an OEM/tray microprocessor |
| Stepping codes | AAEGC AE NAEKC AE |
| Frequency ? | 2500 MHz |
| Bus speed ? | Dual-channel 533 MHz DDR3 SDRAM Memory controller
One 1800 MHz 16-bit HyperTransport link |
| Clock multiplier ? | 12.5 |
| Package | 638-pin micro-PGA |
| AMD Package number | 30600 |
| Socket | Socket S1 (S1g4) |
| Size | 1.38" x 1.38" / 3.5cm x 3.5cm |
| Weight | 0.2oz / 5.6g |
| Introduction date | May 12, 2010 |
| |
| Architecture / Microarchitecture |
| |
| Microarchitecture | K10 |
| Platform | Danube |
| Processor core ? | Champlain |
| Core stepping ? | DA-C3 |
| Manufacturing process | 0.045 micron SOI |
| Data width | 64 bit |
| The number of cores | 2 |
| The number of threads | 2 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 2 x 64 KB instruction caches
2 x 64 KB data caches |
| Level 2 cache size ? | 2 x 1 MB |
| Cache latency | 3 (L1 cache)
15 (L2 cache) |
| Multiprocessing | Uniprocessor |
| Features | - MMX instructions
- 3DNow! technology
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSE4a ?
- AMD64 / AMD 64-bit technology ?
- EVP / Enhanced Virus Protection ?
- VT / Virtualization technology ?
|
| Low power features | PowerNow! |
| |
| Integrated peripherals / components |
| |
| Integrated graphics | None |
| Other peripherals | - Integrated DDR3 SDRAM memory controller
- HyperTransport technology 3.0
|
| |
| Electrical / Thermal parameters |
| |
| Thermal Design Power ? | 35 Watt |
| |
| Notes on AMD TMN530DCR23GM |
| |
- The fastest supported memory is DDR3-1066
|
