Type |
CPU / Microprocessor |
Market segment |
Server |
Family |
AMD Third Generation Opteron |
Model number ? |
2372 HE |
CPU part numbers |
OS2372PAL4DGI is an OEM/tray microprocessor OS2372PAL4DGIWOF is a boxed microprocessor |
Frequency (MHz) ? |
2100 |
Bus speed (MHz) ? |
- 2000 MHz (integrated memory controller)
- 1000 MHz (HyperTransport links)
|
Package |
1207-land lidded LGA |
Socket |
Socket Fr2(1207) |
Introduction date |
Jan 26, 2009 |
Price at introduction |
$316 |
|
Architecture / Microarchitecture |
Processor core ? |
Shanghai |
Core stepping ? |
C2 |
Manufacturing process |
0.045 micron |
Data width |
64 bit |
Number of cores |
4 |
Floating Point Unit |
Integrated |
Level 1 cache size ? |
4 x 64 KB 2-way associative instruction caches 4 x 64 KB 2-way associative data caches |
Level 2 cache size ? |
4 x 512 KB 16-way associative caches |
Level 3 cache size |
6 MB 48-way associative shared cache |
Physical memory |
256 TB |
Multiprocessing |
Up to 2 processors |
Features |
- MMX
- 3DNow!
- SSE
- SSE2
- SSE3
- SSE4a ?
- Advanced Bit Manipulation ?
- AMD64 technology ?
- AMD-V (virtualization) technology
- Enhanced Virus Protection ?
|
Low power features |
- Enhanced PowerNow! ?
- CoolCore technology ?
- Independent Dynamic Core Technology ?
- Dual Dynamic Power Management ?
- Smart Fetch Technology
- C0, C1, S0, S1, S3, S4, and S5 states
|
On-chip peripherals |
- Integrated dual-channel 144-bit DDR2 SDRAM Memory controller
- HyperTransport technology with three 16-bit links
|
|
Electrical/Thermal parameters |
V core (V) ? |
1.2 |
Minimum/Maximum operating temperature (°C) ? |
0 - 55 - 76 |
Average CPU Power (W) |
55 |
Thermal Design Power (W) ? |
79 |