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AMD mobile Sempron SMS3100BQX3LF 

SPECYFIKACJA:

Type CPU / Microprocessor 
Market segment Mobile 
Family AMD Mobile Sempron 
Model number ? 3100+ 
CPU part number SMS3100BQX3LF 
Stepping codes CBBWE CEBDE 
Frequency (MHz) ? 3100+ (rated) 
1800 (real) 
Clock multiplier ? 9 
Package 754-pin lidless organic micro-PGA 
Socket Socket 754 

Architecture / Microarchitecture 
Processor core ? Roma 
Core stepping ? DH-E6 
Manufacturing process 0.09 micron 
Number of cores 1 
Floating Point Unit Integrated 
Level 1 cache size ? 64 KB instruction cache 
64 KB data cache 
Level 2 cache size ? 256 KB 
Features 
* MMX Technology 
* 3DNow! 
* SSE 
* SSE2 
* SSE3 
* Enhanced Virus Protection ? 
Low power features PowerNow! technology 
On-chip peripherals 
* Single-channel DDR SDRAM memory controller 
* One 16-bit HyperTransport link with speeds up to 800 MHz 

Electrical/Thermal parameters 
V core (V) ? 1.2 
Maximum operating temperature (°C) ? 95 
Thermal Design Power (W) ? 25 

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