| General information |
| Type |
CPU / Microprocessor |
| Market segment |
Mobile |
| Family |
AMD Mobile Sempron |
| Model number ? |
SI-40 |
| CPU part number |
SMSI40SAM12GG is an OEM/tray microprocessor |
| Stepping codes |
ABAEB BA OBAJB BA OBALB BA |
| Frequency (MHz) ? |
2000 |
| Bus speed (MHz) ? |
- Dual-channel 333 MHz DDR2 SDRAM Memory controller
- One 1800 MHz 16-bit HyperTransport link
|
| Clock multiplier ? |
10 |
| Package |
638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| AMD Package number |
29882 |
| Socket |
Socket S1 (S1g2) |
| Introduction date |
Jun 4, 2008 |
| |
| Architecture / Microarchitecture |
| Processor core ? |
Sable |
| Core stepping ? |
B1 |
| Manufacturing process |
0.065 micron |
| Data width |
64 bit |
| Number of cores |
1 |
| Floating Point Unit |
Integrated |
| Level 1 cache size ? |
64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? |
512 KB |
| Multiprocessing |
Uniprocessor |
| Features |
- MMX Technology
- 3DNow!
- SSE
- SSE2
- SSE3
- AMD64 technology ?
- Enhanced Virus Protection ?
|
| Low power features |
- Enhanced PowerNow! technology ?
- Independent Dynamic Core technology ?
- Dynamic Power management
- CoolCore technology ?
|
| On-chip peripherals |
- Dual-channel DDR2 SDRAM memory controller
- HyperTransport technology ?
|
| |
| Electrical/Thermal parameters |
| V core (V) ? |
1.075 - 1.125 |
| Maximum operating temperature (°C) ? |
100 |
| Thermal Design Power (W) ? |
25 |
| |
| Notes on AMD SMSI40SAM12GG |
