General information |
|
|
Type |
CPU / Microprocessor |
Market segment |
Mobile |
Family |
AMD Mobile Sempron |
Model number ? |
3400+ |
CPU part number |
- SMS3400HAX3CM is an OEM/tray microprocessor
|
Stepping codes |
ABBVF LEBAF LFBAF NEBAF NFBCF |
Frequency ? |
3400+ (rated) 1800 MHz (real) |
Clock multiplier ? |
9 |
Package |
638-pin lidless micro-PGA 1.38" x 1.38" (3.5 cm x 3.5 cm) |
AMD Package number |
29249 |
Socket |
Socket S1 (S1g1) |
Weight |
0.2oz / 6.8g |
|
Architecture / Microarchitecture |
|
|
Microarchitecture |
K8 |
Processor core ? |
Keene |
Core stepping ? |
F2 |
Manufacturing process |
0.09 micron |
Data width |
64 bit |
The number of cores |
1 |
The number of threads |
1 |
Floating Point Unit |
Integrated |
Level 1 cache size ? |
64 KB instruction cache 64 KB data cache |
Level 2 cache size ? |
256 KB |
Multiprocessing |
Uniprocessor |
Features |
- MMX instructions
- 3DNow! technology
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- AMD64 / AMD 64-bit technology ?
- EVP / Enhanced Virus Protection ?
|
Low power features |
PowerNow! technology |
|
Integrated peripherals / components |
|
|
Integrated graphics |
None |
Memory controller |
- The number of controllers: 1
Memory channels: 2 Supported memory: DDR2
|
Other peripherals |
One 16-bit HyperTransport link with speeds up to 800 MHz |
|
Electrical / Thermal parameters |
|
|
V core ? |
1.125V / 1.15V / 1.2V |
Maximum operating temperature ? |
95°C |
Thermal Design Power ? |
25 Watt |